Normal view MARC view ISBD view

Modeling and simulation for microelectronic packaging assembly : manufacturing, reliability, and testing /

Liu, Sheng. ,

Modeling and simulation for microelectronic packaging assembly : manufacturing, reliability, and testing / Sheng Liu, Yong Liu. - xxii, 564 pages : illustrations ; 26 cm.

ISBN: 9780470827802 0470827807

Subjects--Topical Terms:
Microelectronic packaging --Simulation methods.

LC Class. No.: TK7870.15 / .L58 2011

Place recall
Print
Add to your cart (remove)
Save record
BIBTEX Dublin Core MARCXML MARC (non-Unicode/MARC-8) MARC (Unicode/UTF-8) MARC (Unicode/UTF-8, Standard) MODS (XML) RIS ISBD
More searches

Search for this title in:
Other Libraries (WorldCat) Other Databases (Google Scholar) Online Stores (Bookfinder.com) Open Library (openlibrary.org)