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Electrical modeling and design for 3D integration : 3D integrated circuits and packaging signal integrity, power integrity, and EMC / Er-Ping Li.
Material type:
TextPublisher: Hoboken, N.J. : Wiley-IEEE Press, 2011Description: xiv, 366 pages : illustrations ; 24 cmContent type: - text
- unmediated
- volume
- 9780470623466
- TK7874.893 .L53 2011
| Item type | Current library | Call number | Status | Date due | Barcode | |
|---|---|---|---|---|---|---|
| Books - Printed | PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH Main Library General | TK7874.893 .L53 2011 (Browse shelf(Opens below)) | Available | 1000289176 |
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| TK7874.887 .S54 2014 Nanomagnetism and spintronics / | TK7874.887 .X52 2012 Semiconductor spintronics / | TK7874.893 .K42 2012 Designing TSVs for 3d integrated circuits / | TK7874.893 .L53 2011 Electrical modeling and design for 3D integration : 3D integrated circuits and packaging signal integrity, power integrity, and EMC / | TK7874.9 .T74 2007 Electron beams and microwave vacuum electronics / | TK7874.9 .V32 2008 Vacuum electronics : components and devices / | TK7875 .A32 2010 Introductory MEMS : fabrication and applications / |
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