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Designing TSVs for 3d integrated circuits / Nauman Khan, Soha Hassoun.
Material type:
TextPublisher: New York : Springer, 2012Description: x, 76 pages : illustrationsContent type: - text
- unmediated
- volume
- 9781461455073
- TK7874.893 .K42 2012
| Item type | Current library | Call number | Status | Date due | Barcode | |
|---|---|---|---|---|---|---|
| Books - Printed | PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH Main Library General | TK7874.893 .K42 2012 (Browse shelf(Opens below)) | Available | 1000304387 |
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| TK7874.887 .O73 2010 Organic spintronics / | TK7874.887 .S54 2014 Nanomagnetism and spintronics / | TK7874.887 .X52 2012 Semiconductor spintronics / | TK7874.893 .K42 2012 Designing TSVs for 3d integrated circuits / | TK7874.893 .L53 2011 Electrical modeling and design for 3D integration : 3D integrated circuits and packaging signal integrity, power integrity, and EMC / | TK7874.9 .T74 2007 Electron beams and microwave vacuum electronics / | TK7874.9 .V32 2008 Vacuum electronics : components and devices / |
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