Integrated circuit, hybrid and multichip module package design guidelines : a focus on realibility / Michael Pecht.

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TextPublisher: New York : John Wiley, 1994Description: xxxi, 426 pages : illustrations ; 25 cmContent type:

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Holdings
Item type	Current library	Call number	Status	Date due	Barcode
Books - Printed	PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH Main Library General	TK7870.15 .P43 1994 (Browse shelf(Opens below))	Available		1000026895
Books - Printed	PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH Main Library General	TK7870.15 .P43 1994 (Browse shelf(Opens below))	Available		1000026899

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Previous	TK7870.15 .M52 2005 Microelectronic packaging /	TK7870.15 .N36 2008 Nanopackaging : nanotechnologies and electronics packaging /	TK7870.15 .P32 2001 Packaging, reliability and manufacturing issues associated with electronic and photonic products /	TK7870.15 .P43 1994 Integrated circuit, hybrid and multichip module package design guidelines : a focus on realibility /	TK7870.15 .P43 1994 Integrated circuit, hybrid and multichip module package design guidelines : a focus on realibility /	TK7870.15 .P434 1993 Soldering processes and equipment /	TK7870.15 .P47 2009 Solder joint reliability prediction for multiple environments /	Next

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