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Materials for electronic packaging / edited by Deborah D. L. Chung.
Material type:
TextPublisher: Boston : Butterworth-Heinemann, 1995Description: xiv, 368p. : illustrations ; 24 cmContent type: - text
- unmediated
- volume
- 0750693142
- TK7870.15 .M38 1995
| Item type | Current library | Call number | Status | Date due | Barcode | |
|---|---|---|---|---|---|---|
| Books - Printed | PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH Main Library General | TK7870.15 .M38 1995 (Browse shelf(Opens below)) | Available | 1000007764 |
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| TK7870.15 .L42 2004 Lead-free soldering in electronics : science, technology and environmental impact / | TK7870.15 .L58 2011 Modeling and simulation for microelectronic packaging assembly : manufacturing, reliability, and testing / | TK7870.15 .L59 2009 Electrical conductive adhesives with nanotechnologies / | TK7870.15 .M38 1995 Materials for electronic packaging / | TK7870.15 .M52 2005 Microelectronic packaging / | TK7870.15 .N36 2008 Nanopackaging : nanotechnologies and electronics packaging / | TK7870.15 .P32 2001 Packaging, reliability and manufacturing issues associated with electronic and photonic products / |
Includes bibliographical references (pages 358-368) and index.
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