Area array packing handbook : manufacturing and assembly / Ken Gilleo.
Material type:
- text
- unmediated
- volume
- 0071374930
- TK7870.15 .G54 2002
Item type | Current library | Call number | Status | Date due | Barcode | |
---|---|---|---|---|---|---|
Books - Printed | PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH Main Library General | TK7870.15 .G54 2002 (Browse shelf(Opens below)) | Available | 1000050617 |
Browsing PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH shelves, Shelving location: Main Library General Close shelf browser (Hides shelf browser)
![]() |
![]() |
![]() |
![]() |
![]() |
![]() |
![]() |
||
TK7870.15 .E43 2000 Electronic packaging and interconnection handbook / | TK7870.15 .F86 2001 Fundamentals of microsystems packaging / | TK7870.15 .F86 2001 Fundamentals of microsystems packaging / | TK7870.15 .G54 2002 Area array packing handbook : manufacturing and assembly / | TK7870.15 .G55 2005 MEMS/MOEMS packaging : concepts, designs, materials and processes / | TK7870.15 .H37 2005 Electronic packaging and interconnection handbook / | TK7870.15 .L42 2004 Lead-free soldering in electronics : science, technology and environmental impact / |
1 3
There are no comments on this title.
Log in to your account to post a comment.