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Area array package design : techniques in high-density electronics / edited by Ken Gilleo.
Material type:
TextPublisher: New York : McGraw-Hill, 2004Description: xii, 204 pages : illustrations ; 25 cmContent type: - text
- unmediated
- volume
- 0071428275
- TK7870.15 .A734 2004
| Item type | Current library | Call number | Status | Date due | Barcode | |
|---|---|---|---|---|---|---|
| Books - Printed | PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH Main Library General | TK7870.15 .A734 2004 (Browse shelf(Opens below)) | Available | 1000108950 |
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| TK7870 .W54 2004 The circuit designer's companion / | TK7870.15 .A73 2004 Area array packaging materials : adhesives, pastes and lead-free / | TK7870.15 .A73 2004 Area array packaging materials : adhesives, pastes and lead-free / | TK7870.15 .A734 2004 Area array package design : techniques in high-density electronics / | TK7870.15 .B56 2012 Bio and nano packaging techniques for electron devices / | TK7870.15 .C42 2010 Characterization of integrated circuit packaging materials / | TK7870.15 .C66 2003 Contamination of electronic assemblies / |
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