Solder joint reliability prediction for multiple environments / Andrew E. Perkins, Suresh K. Sitaraman.

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TextPublisher: New York : Springer, 2009Description: xv, 192 pages : illustrations ; 24 cmContent type:

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Holdings
Item type	Current library	Call number	Status	Date due	Barcode
Books - Printed	PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH Main Library General	TK7870.15 .P47 2009 (Browse shelf(Opens below))	Available		1000231377

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