TY  - BOOK
AU  - Lau,John H.
TI  - Low cost flip chip technologies: for DCA WLCSP, and PBGA assemblies 
SN  - 0071351418
AV  - TK7874  .L382 2000
PY  - 2000///
CY  - New York
PB  - McGraw-Hill
KW  - Multichip modules (Microelectronics)
KW  - Design and construction
KW  - Microelectronic packaging
ER  -