TY  - BOOK
AU  - Sitaraman,Suresh
ED  - ASME International Mechanical Engineering Congresses and Exposition :
TI  - Packaging, reliability and manufacturing issues associated with electronic and photonic products
SN  - 0791835650
AV  - TK7870.15  .32 2001
PY  - 2001///
CY  - New York
PB  - The American Society of Mechanical Engineers
KW  - Electronic packaging
KW  - Reliability
KW  - Congresses
ER  -