Area array packaging processes :  for BGA, flip chip and CSP / 
editor, Ken Gilleo. 
 - x, 260 pages :  illustrations ;  25 cm. 
<br/><br/><label>ISBN: </label>0071428291 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Microelectronic packaging.<br/>Multichip modules (Microelectronics).
<br/><br/><label>LC Class. No.: </label>TK7874   / .A73 2004