TY  - BOOK
AU  - Gilleo,Ken
TI  - Area array packaging processes: for BGA, flip chip and CSP 
SN  - 0071428291
AV  - TK7874  .A73 2004
PY  - 2004///
CY  - New York
PB  - McGraw-Hill
KW  - Microelectronic packaging
KW  - Multichip modules (Microelectronics)
ER  -