TY  - BOOK
AU  - DiGiacomo,Giulio
TI  - Reliability of electronic packages and semiconductor devices
SN  - 007017024X
AV  - TK7871.85  .D43 1997
PY  - 1997///
CY  - New York
PB  - McGraw-Hill
KW  - Semiconductors
KW  - Reliability
KW  - Microelectronic packaging
ER  -