TY  - BOOK
AU  - Lu,Daniel
AU  - Wong,C.P.
TI  - Materials for advanced packaging
SN  - 9780387782188
AV  - TK7874  .M38 2009
PY  - 2009///
CY  - New York
PB  - Springer
KW  - Packaging
KW  - Materials
KW  - Microelectronic packaging
ER  -