Lau, John H. , <br/><br/>
Solder joint reliability of BGA, CSP, fine picth SMT assemblies / 
John H. LAu, Yi-Hsin Pao. 
<br/><br/><label>ISBN: </label>0070366489 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Microelectronic pakaging --Reliability.<br/>Solder and soldering --TEsting.<br/>Multichip modules (Microelectronics) --Testing.
<br/><br/><label>LC Class. No.: </label>TK7874   / .L38 1997