TY  - BOOK
AU  - Lau,John H.
AU  - Pao, Yi-Hsin.
TI  - Solder joint reliability of BGA, CSP, fine picth SMT assemblies
SN  - 0070366489
AV  - TK7874  .L38 1997
PY  - 1997///
CY  - New York
PB  - McGraw-Hill
KW  - Microelectronic pakaging
KW  - Reliability
KW  - Solder and soldering
KW  - TEsting
KW  - Multichip modules (Microelectronics)
KW  - Testing
ER  -