Liu, Sheng. , <br/><br/>
Modeling and simulation for microelectronic packaging assembly :  manufacturing, reliability, and testing / 
Sheng Liu, Yong Liu. 
 - xxii, 564 pages :  illustrations ;  26 cm. 
<br/><br/><label>ISBN: </label>9780470827802 0470827807 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Microelectronic packaging --Simulation methods.
<br/><br/><label>LC Class. No.: </label>TK7870.15   / .L58 2011