TY  - BOOK
AU  - Liu,Sheng
AU  - Liu,Yong
TI  - Modeling and simulation for microelectronic packaging assembly: manufacturing, reliability, and testing 
SN  - 9780470827802
AV  - TK7870.15  .L58 2011
PY  - 2011///
CY  - Singapore
PB  - Wiley
KW  - Microelectronic packaging
KW  - Simulation methods
ER  -