TY  - BOOK
AU  - Pecht,Michael
TI  - Integrated circuit, hybrid and multichip module package design guidelines: a focus on realibility 
SN  - 0471594466
AV  - TK7870.15  .P43 1994
PY  - 1994///
CY  - New York
PB  - John Wiley
KW  - Electronic packaging
KW  - Design
KW  - Hybrid integrated circuits
KW  - Design and construction
KW  - Multichip modules (Microelectronics)
ER  -