TY  - BOOK
AU  - Harper,Charles A.
TI  - Electronic assembly fabrication: chips, circuit boards, packages, and components 
T2  - Electronic packaging and interconnection series
SN  - 0071378820
AV  - TK7870  .E44 2002
PY  - 2002///]
CY  - New York
PB  - McGraw-Hill
KW  - Electronic apparatus and appliances
KW  - Design and construction
ER  -