TY  - BOOK
AU  - Gilleo,Ken
TI  - Area array packaging materials: adhesives, pastes and lead-free 
SN  - 0071428283
AV  - TK7870.15  .A73 2004
PY  - 2004///
CY  - New York
PB  - McGraw-Hill
KW  - Ball grid array technology
KW  - Microelectronic packaging
ER  -