TY  - BOOK
AU  - Perkins,Andrew E.
AU  - Sitaraman,Suresh K.
TI  - Solder joint reliability prediction for multiple environments
SN  - 9780387793931
AV  - TK7870.15  .P47 2009
PY  - 2009///
CY  - New York
PB  - Springer
KW  - Electronic apparatus and appliances
KW  - Reliability
KW  - Solder and soldering
KW  - Joints (Engineering)
ER  -