Your search returned 122 results.

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	21.	Electrical conductive adhesives with nanotechnologies / Yi Li, Daniel Lu, C. P. Wong, by Li, Yi Lu, Daniel Wong, C. P Material type: Text; Format: print Publication details: New York : Springer, 2010 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (1)Call number: TK7870.15 .L59 2009. Place hold Place recall Add to cart (remove)
	22.	Characterization of integrated circuit packaging materials / editors,Thomas Moore and Robert McKenna by Moore, Thomas McKenna, Robert Series: Material type: Text; Format: print Publication details: New York : Momentum, 2010 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (1)Call number: TK7870.15 .C42 2010. Place hold Place recall Add to cart (remove)
	23.	Ceramic interconnect technology handbook / edited by Fred D. Barlow, Aicha Elshabini by Barlow, Fred D Elshabini, Aicha Material type: Text; Format: print Publication details: Boca Raton, FL : CRC, 2007 Availability: No items available. Place recall Add to cart (remove)
	24.	LED packaging for lighting applications : design, manufacturing, and testing / Sheng Liu, Xiaobing Luo. by Liu, S [author] Luo, Xiaobing Material type: Text; Format: print ; Literary form: Not fiction Publisher: Hoboken, N.J. : Wiley, 2011 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (1)Call number: TK7871.89.L53 .L58 2011. Place hold Place recall Add to cart (remove)
	25.	Food and beverage packaging technology / edited by Richard Coles, Mark Kirwan. by Kirwan, Mark J Edition: 2nd ed. Material type: Text; Format: print ; Literary form: Not fiction Publisher: Chichester, West Sussex ; Ames, Iowa : Wiley-Blackwell, 2011 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (1)Call number: TP374 .F68 2011. Place hold Place recall Add to cart (remove)
	26.	Modeling and simulation for microelectronic packaging assembly : manufacturing, reliability, and testing / Sheng Liu, Yong Liu. by Liu, Sheng [author] Liu, Yong Material type: Text; Format: print ; Literary form: Not fiction Publisher: Singapore : Wiley, 2011 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (1)Call number: TK7870.15 .L58 2011. Place hold Place recall Add to cart (remove)
	27.	Bio and nano packaging techniques for electron devices / editors, Gerald Gerlach, Klaus-Jurgen Wolter. Material type: Text; Format: print ; Literary form: Not fiction Publisher: New York : Springer, 2012 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (1)Call number: TK7870.15 .B56 2012. Place hold Place recall Add to cart (remove)
	28.	Electronic techniques : shop practices and construction / Robert S. Villanucci, Alexander W. Avtgis, William F. Megow. by Villanucci, Robert S [author] Megow, William F Avtgis, Alexander W Edition: 4th ed. Material type: Text; Format: print Publisher: Englewood Cliffs, New Jersey : Prentice-Hall, 1991 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (1)Call number: TK7870.15 .V55 1991. Place hold Place recall Add to cart (remove)
	29.	Electronic techniques : shop practices and construction / Robert S. Villanucci, Alexander W. Avtgis, William F. Megow. by Villanucci, Robert S [author] Megow, William F Avtgis, Alexander W Edition: 6th ed. Material type: Text; Format: print Publisher: Upper Saddle River, New Jersey : Prentice-Hall, 1999 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (1)Call number: TK7836 .V56 1999. Place hold Place recall Add to cart (remove)
	30.	Electronic packaging and interconnection handbook / Charles A. Harper. by Harper, Charles A [author] Edition: 3rd ed. Material type: Text; Format: print Publisher: New York : McGraw-Hill, 2000 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (1)Call number: TK7870.15 .E43 2000. Place hold Place recall Add to cart (remove)
	31.	Integrated circuit, hybrid and multichip module package design guidelines : a focus on realibility / Michael Pecht. by Pecht, Michael [author] Material type: Text; Format: print Publisher: New York : John Wiley, 1994 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (2)Call number: TK7870.15 .P43 1994, ... Place hold Place recall Add to cart (remove)
	32.	Fundamentals of microsystems packaging / editor, Rao R. Tummala. by Rao, R. Tummala Material type: Text; Format: print Publisher: New York : McGraw-Hill, 2001 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (2)Call number: TK7870.15 .F86 2001, ... Place hold Place recall Add to cart (remove)
	33.	Materials for electronic packaging / edited by Deborah D. L. Chung. by Chung, Deborah D L Material type: Text; Format: print Publisher: Boston : Butterworth-Heinemann, 1995 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (1)Call number: TK7870.15 .M38 1995. Place hold Place recall Add to cart (remove)
	34.	Fundamentals of microfabrication : the science of miniaturization / Marc J. Madou. by Madou, Marc J [author] Edition: 2nd ed. Material type: Text; Format: print Publisher: Boca Raton, FL : CRC Press, 2002 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (2)Call number: TK7836 .M32 2002, ... Place hold Place recall Add to cart (remove)
	35.	Area array packing handbook : manufacturing and assembly / Ken Gilleo. by Gilleo, Ken [author] Series: Material type: Text; Format: print Publisher: New York : McGraw-Hill, [2002]Copyright date: ©2002 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (1)Call number: TK7870.15 .G54 2002. Place hold Place recall Add to cart (remove)
	36.	Thermal design of electronic equipment / Ralph Remsburg. by Remsburg, Ralph [author] Material type: Text; Format: print Publisher: Boca Raton, FL : CRC Press, 2001 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (1)Call number: TK7870.25 .R454 2001. Place hold Place recall Add to cart (remove)
	37.	Reflow soldering processes : SMT, BGA, CSP AND flip chip technology / Ning-Cheng Lee. by Lee, Ning-Cheng [author] Material type: Text; Format: print Publisher: Boston : Newnes, 2002 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (1)Call number: TK7836 .L43 2002. Place hold Place recall Add to cart (remove)
	38.	Contamination of electronic assemblies / Michael Pecht ... [and others]. by Pecht, Michael Series: Material type: Text; Format: print Publisher: Boca Raton, FL : CRC Press, 2003 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (1)Call number: TK7870.15 .C66 2003. Place hold Place recall Add to cart (remove)
	39.	RF measurements of die and packages / Scott A. Wartenberg. by Wartenberg, Scott A [author] Series: Material type: Text; Format: print Publisher: Boston, MA : Artech House, 2002 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (2)Call number: TK7874.7 .W37 2002, ... Place hold Place recall Add to cart (remove)
	40.	Boundary-scan interconnect diagnosis / Jose T. de Sousa and Peter Y.K. Cheung. by Sousa, Jose T. de [author] Cheung, Peter Y. K Series: Material type: Text; Format: print Publisher: Boston, MA : Kluwer Academic, 2001 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (1)Call number: TK7870.23 .S68 2001. Place hold Place recall Add to cart (remove)

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Your search returned 122 results.