Your search returned 4 results.

Sort
Results
1.
Integrated circuit, hybrid and multichip module package design guidelines : a focus on realibility / Michael Pecht. by
Material type: Text Text; Format: print
Publisher: New York : John Wiley, 1994
Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (2)Call number: TK7870.15 .P43 1994, ...

2.
Contamination of electronic assemblies / Michael Pecht ... [and others]. by Series:
Material type: Text Text; Format: print
Publisher: Boca Raton, FL : CRC Press, 2003
Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (1)Call number: TK7870.15 .C66 2003.

3.
IC component sockets / Weifeng Liu, Michael Pecht. by
Material type: Text Text; Format: print
Publisher: Hoboken, NJ : John Wiley, 2004
Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (1)Call number: TK7868.P7 .L58 2004.

4.
Lead-free electronics / edited by Sanka Ganesan, Michael Pecht. by
Material type: Text Text; Format: print
Publisher: Hoboken, NJ : John Wiley, 2006
Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (1)Call number: TK7870 .L42 2006.

Pages

Powered by Koha