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	1.	Electrical modeling and design for 3D integration : 3D integrated circuits and packaging signal integrity, power integrity, and EMC / Er-Ping Li. by Li, Er-Ping [author] Material type: Text; Format: print ; Literary form: Not fiction Publisher: Hoboken, N.J. : Wiley-IEEE Press, 2011 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (1)Call number: TK7874.893 .L53 2011. Place hold Place recall Add to cart (remove)
	2.	Designing TSVs for 3d integrated circuits / Nauman Khan, Soha Hassoun. by Khan, Nauman [author] Hassoun, Soha Material type: Text; Format: print ; Literary form: Not fiction Publisher: New York : Springer, 2012 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (1)Call number: TK7874.893 .K42 2012. Place hold Place recall Add to cart (remove)

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