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	1.	Integrated circuit, hybrid and multichip module package design guidelines : a focus on realibility / Michael Pecht. by Pecht, Michael [author] Material type: Text; Format: print Publisher: New York : John Wiley, 1994 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (2)Call number: TK7870.15 .P43 1994, ... Place hold Place recall Add to cart (remove)
	2.	Area array package design : techniques in high-density electronics / edited by Ken Gilleo. by Gilleo, Ken Material type: Text; Format: print Publisher: New York : McGraw-Hill, 2004 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (1)Call number: TK7870.15 .A734 2004. Place hold Place recall Add to cart (remove)

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