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1.
Electronic packaging and interconnection handbook / Charles A. Harper. by
Edition: 3rd ed.
Material type: Text Text; Format: print
Publisher: New York : McGraw-Hill, 2000
Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (1)Call number: TK7870.15 .E43 2000.

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2.
Fundamentals of microsystems packaging / editor, Rao R. Tummala. by
Material type: Text Text; Format: print
Publisher: New York : McGraw-Hill, 2001
Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (2)Call number: TK7870.15 .F86 2001, ...

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3.
Electronic packaging and interconnection handbook / Charles A. Harper. by
Edition: 4th ed.
Material type: Text Text; Format: print
Publisher: New York : McGraw-Hill, 2005
Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (1)Call number: TK7870.15 .H37 2005.

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