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Packaging, reliability and manufacturing issues associated with electronic and photonic products / edited by Suresh Sitraman...[et al.] by
Material type: Text Text; Format: print
Publication details: New York : The American Society of Mechanical Engineers, 2001
Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (1)Call number: TK7870.15 .P32 2001.

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