Your search returned 32 results.

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	1.	Electronic packaging and interconnection handbook / Charles A. Harper, editor-in-chief by Harper, Charles A Material type: Text; Format: print Publication details: New York : McGraw-Hill, 1991 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (1)Call number: TK7870.15 E38H . Place hold Place recall Add to cart (remove)
	2.	Electronic physical design / Barry M. Lunt. by Lunt, Barry M [author] Edition: 1st ed. Material type: Text; Format: print Publisher: Upper Saddle River, NJ : Prentice Hall, 2004 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (1)Call number: TK7870 .L86 2004. Place hold Place recall Add to cart (remove)
	3.	Electronic packaging and interconnection handbook / Charles A. Harper, editor in Chief by Harper, Charles A Edition: 2nd ed. Material type: Text; Format: print Publication details: New York : McGraw-Hill, 1997 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (1)Call number: TK7870.15 .E43 1997. Place hold Place recall Add to cart (remove)
	4.	Electrical conductive adhesives with nanotechnologies / Yi Li, Daniel Lu, C. P. Wong, by Li, Yi Lu, Daniel Wong, C. P Material type: Text; Format: print Publication details: New York : Springer, 2010 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (1)Call number: TK7870.15 .L59 2009. Place hold Place recall Add to cart (remove)
	5.	Characterization of integrated circuit packaging materials / editors,Thomas Moore and Robert McKenna by Moore, Thomas McKenna, Robert Series: Material type: Text; Format: print Publication details: New York : Momentum, 2010 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (1)Call number: TK7870.15 .C42 2010. Place hold Place recall Add to cart (remove)
	6.	Ceramic interconnect technology handbook / edited by Fred D. Barlow, Aicha Elshabini by Barlow, Fred D Elshabini, Aicha Material type: Text; Format: print Publication details: Boca Raton, FL : CRC, 2007 Availability: No items available. Place recall Add to cart (remove)
	7.	LED packaging for lighting applications : design, manufacturing, and testing / Sheng Liu, Xiaobing Luo. by Liu, S [author] Luo, Xiaobing Material type: Text; Format: print ; Literary form: Not fiction Publisher: Hoboken, N.J. : Wiley, 2011 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (1)Call number: TK7871.89.L53 .L58 2011. Place hold Place recall Add to cart (remove)
	8.	Electronic techniques : shop practices and construction / Robert S. Villanucci, Alexander W. Avtgis, William F. Megow. by Villanucci, Robert S [author] Megow, William F Avtgis, Alexander W Edition: 4th ed. Material type: Text; Format: print Publisher: Englewood Cliffs, New Jersey : Prentice-Hall, 1991 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (1)Call number: TK7870.15 .V55 1991. Place hold Place recall Add to cart (remove)
	9.	Electronic techniques : shop practices and construction / Robert S. Villanucci, Alexander W. Avtgis, William F. Megow. by Villanucci, Robert S [author] Megow, William F Avtgis, Alexander W Edition: 6th ed. Material type: Text; Format: print Publisher: Upper Saddle River, New Jersey : Prentice-Hall, 1999 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (1)Call number: TK7836 .V56 1999. Place hold Place recall Add to cart (remove)
	10.	Electronic packaging and interconnection handbook / Charles A. Harper. by Harper, Charles A [author] Edition: 3rd ed. Material type: Text; Format: print Publisher: New York : McGraw-Hill, 2000 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (1)Call number: TK7870.15 .E43 2000. Place hold Place recall Add to cart (remove)
	11.	Integrated circuit, hybrid and multichip module package design guidelines : a focus on realibility / Michael Pecht. by Pecht, Michael [author] Material type: Text; Format: print Publisher: New York : John Wiley, 1994 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (2)Call number: TK7870.15 .P43 1994, ... Place hold Place recall Add to cart (remove)
	12.	Fundamentals of microsystems packaging / editor, Rao R. Tummala. by Rao, R. Tummala Material type: Text; Format: print Publisher: New York : McGraw-Hill, 2001 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (2)Call number: TK7870.15 .F86 2001, ... Place hold Place recall Add to cart (remove)
	13.	Materials for electronic packaging / edited by Deborah D. L. Chung. by Chung, Deborah D L Material type: Text; Format: print Publisher: Boston : Butterworth-Heinemann, 1995 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (1)Call number: TK7870.15 .M38 1995. Place hold Place recall Add to cart (remove)
	14.	Thermal design of electronic equipment / Ralph Remsburg. by Remsburg, Ralph [author] Material type: Text; Format: print Publisher: Boca Raton, FL : CRC Press, 2001 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (1)Call number: TK7870.25 .R454 2001. Place hold Place recall Add to cart (remove)
	15.	Reflow soldering processes : SMT, BGA, CSP AND flip chip technology / Ning-Cheng Lee. by Lee, Ning-Cheng [author] Material type: Text; Format: print Publisher: Boston : Newnes, 2002 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (1)Call number: TK7836 .L43 2002. Place hold Place recall Add to cart (remove)
	16.	Contamination of electronic assemblies / Michael Pecht ... [and others]. by Pecht, Michael Series: Material type: Text; Format: print Publisher: Boca Raton, FL : CRC Press, 2003 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (1)Call number: TK7870.15 .C66 2003. Place hold Place recall Add to cart (remove)
	17.	Boundary-scan interconnect diagnosis / Jose T. de Sousa and Peter Y.K. Cheung. by Sousa, Jose T. de [author] Cheung, Peter Y. K Series: Material type: Text; Format: print Publisher: Boston, MA : Kluwer Academic, 2001 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (1)Call number: TK7870.23 .S68 2001. Place hold Place recall Add to cart (remove)
	18.	Packaging, reliability and manufacturing issues associated with electronic and photonic products / edited by Suresh Sitraman...[et al.] by Sitaraman, Suresh ASME International Mechanical Engineering Congresses and Exposition 2001 : New York Material type: Text; Format: print Publication details: New York : The American Society of Mechanical Engineers, 2001 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (1)Call number: TK7870.15 .P32 2001. Place hold Place recall Add to cart (remove)
	19.	Electronic packaging and interconnection handbook / Charles A. Harper. by Harper, Charles A [author] Edition: 4th ed. Material type: Text; Format: print Publisher: New York : McGraw-Hill, 2005 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (1)Call number: TK7870.15 .H37 2005. Place hold Place recall Add to cart (remove)
	20.	Area array package design : techniques in high-density electronics / edited by Ken Gilleo. by Gilleo, Ken Material type: Text; Format: print Publisher: New York : McGraw-Hill, 2004 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (1)Call number: TK7870.15 .A734 2004. Place hold Place recall Add to cart (remove)

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Your search returned 32 results.