000 01003cam a22002894i 4500
001 u151586
003 SIRSI
005 20240619145440.0
008 030610s2003 maua b 001 0 eng
020 _a9781402075438
020 _a140207543X
050 0 0 _aTS695
_b.B37 2003
100 1 _aBarnat, Edward V. ,
_eauthor
_977744
245 1 0 _aPulsed and pulsed bias sputtering :
_bprinciples and applications /
_cby Edward V. Barnat, Toh-Ming Lu.
264 1 _aBoston :
_bKluwer Academic,
_c2003.
300 _ax, 155 pages :
_billustrations ;
_c24 cm.
336 _atext
_btxt
_2rdacontent
337 _aunmediated
_bn
_2rdamedia
338 _avolume
_bnc
_2rdacarrier
596 _a1 3
650 0 _aCathode sputtering (Plating process).
_977745
650 0 _aThin films.
_97928
700 1 _aLu, Toh Ming.
_977746
907 _a.b10260213
_b07-11-22
_c12-09-18
998 _am
_b06-11-22
_cm
_da
_e-
_feng
_gmau
_h0
999 _c17399
_d17399