| 000 | 00900cam a2200253 i 4500 | ||
|---|---|---|---|
| 001 | u21333 | ||
| 003 | SIRSI | ||
| 005 | 20240619145527.0 | ||
| 008 | 020220 00 eng | ||
| 020 | _a0071351418 | ||
| 050 |
_aTK7874 _b.L382 2000 |
||
| 100 | 1 |
_aLau, John H. , _eauthor _924049 |
|
| 245 | 1 | 0 |
_aLow cost flip chip technologies : _bfor DCA WLCSP, and PBGA assemblies / _cJohn H. Lau. |
| 264 | 1 |
_aNew York : _bMcGraw-Hill, _c2000. |
|
| 336 |
_atext _btxt _2rdacontent |
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| 337 |
_aunmediated _bn _2rdamedia |
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| 338 |
_avolume _bnc _2rdacarrier |
||
| 596 | _a1 3 | ||
| 650 | 0 |
_aMultichip modules (Microelectronics) _xDesign and construction. _986542 |
|
| 650 | 0 |
_aMicroelectronic packaging. _924050 |
|
| 907 |
_a.b10281605 _b07-11-22 _c12-09-18 |
||
| 998 |
_am _b06-11-22 _cm _da _e- _feng _g _h0 |
||
| 999 |
_c19531 _d19531 |
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