| 000 | 00918cam a2200265 i 4500 | ||
|---|---|---|---|
| 001 | u55392 | ||
| 003 | SIRSI | ||
| 005 | 20240619145729.0 | ||
| 008 | 110131 eng | ||
| 020 | _a0071428291 | ||
| 050 |
_aTK7874 _b.A73 2004 |
||
| 245 | 0 | 0 |
_aArea array packaging processes : _bfor BGA, flip chip and CSP / _ceditor, Ken Gilleo. |
| 264 | 1 |
_aNew York : _bMcGraw-Hill, _c2004. |
|
| 300 |
_ax, 260 pages : _billustrations ; _c25 cm. |
||
| 336 |
_atext _btxt _2rdacontent |
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| 337 |
_aunmediated _bn _2rdamedia |
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| 338 |
_avolume _bnc _2rdacarrier |
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| 596 | _a1 3 | ||
| 650 | 0 |
_aMicroelectronic packaging. _924050 |
|
| 650 | 0 |
_aMultichip modules (Microelectronics). _986542 |
|
| 700 | 1 |
_aGilleo, Ken. _9125494 |
|
| 907 |
_a.b1033645x _b07-11-22 _c12-09-18 |
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| 998 |
_am _b06-11-22 _cm _da _e- _feng _g _h0 |
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| 999 |
_c25015 _d25015 |
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