| 000 | 00965cam a2200289 i 4500 | ||
|---|---|---|---|
| 001 | u72468 | ||
| 003 | SIRSI | ||
| 005 | 20240619145822.0 | ||
| 008 | 110131 eng | ||
| 020 | _a9781402045783 | ||
| 020 | _a1402045786 | ||
| 050 |
_aTK7874 _b.D94 2006 |
||
| 100 | 1 |
_aDziuban, J. A.. , _eauthor _9181354 |
|
| 245 | 1 | 0 |
_aBonding in microsystem technology / _cJ. A. Dziuban. |
| 264 | 1 |
_aNew York : _bSpringer, _c2006. |
|
| 300 |
_axviii, 331 pages : _billustrations ; _c25 cm. |
||
| 336 |
_atext _btxt _2rdacontent |
||
| 337 |
_aunmediated _bn _2rdamedia |
||
| 338 |
_avolume _bnc _2rdacarrier |
||
| 490 | 1 |
_aSpringer series in advanced microelectronics ; _v24 |
|
| 596 | _a1 3 | ||
| 650 | 0 |
_aMicrotechnology. _927135 |
|
| 650 | 0 |
_aMicromachining. _912728 |
|
| 907 |
_a.b10360839 _b07-11-22 _c12-09-18 |
||
| 998 |
_am _b06-11-22 _cm _da _e- _feng _g _h0 |
||
| 999 |
_c27453 _d27453 |
||