| 000 | 00927cam a22002655i 4500 | ||
|---|---|---|---|
| 001 | u146517 | ||
| 003 | SIRSI | ||
| 005 | 20240619150252.0 | ||
| 008 | 120810s2012 nyu 000 0 eng | ||
| 020 | _a9781461455073 | ||
| 050 |
_aTK7874.893 _b.K42 2012 |
||
| 100 | 1 |
_aKhan, Nauman. , _eauthor _970893 |
|
| 245 | 1 | 0 |
_aDesigning TSVs for 3d integrated circuits / _cNauman Khan, Soha Hassoun. |
| 264 | 1 |
_aNew York : _bSpringer, _c2012. |
|
| 300 |
_ax, 76 pages : _billustrations ; _c. |
||
| 336 |
_atext _btxt _2rdacontent |
||
| 337 |
_aunmediated _bn _2rdamedia |
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| 338 |
_avolume _bnc _2rdacarrier |
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| 596 | _a3 | ||
| 650 | 0 |
_aThree-dimensional integrated circuits _xDesign and construction. _957280 |
|
| 700 | 1 |
_aHassoun, Soha. _970894 |
|
| 907 |
_a.b10484218 _b07-11-22 _c31-12-18 |
||
| 998 |
_am _b06-11-22 _cm _da _e- _feng _gnyu _h0 |
||
| 999 |
_c39779 _d39779 |
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