000 00938cam a2200277 i 4500
001 u57013
003 SIRSI
005 20240619150423.0
008 110131 eng
020 _a0863413358
050 _aTK7875
_b.M46 2004
245 0 0 _aMems packaging /
_cedited by Tai-Ran Hsu.
264 1 _aLondon :
_bInstitution of Electrical Engineers,
_c2004.
300 _axxix, 275 pages :
_billustrations ;
_c26 cm.
336 _atext
_btxt
_2rdacontent
337 _aunmediated
_bn
_2rdamedia
338 _avolume
_bnc
_2rdacarrier
490 1 _aEMIS processing series ;
_v3
596 _a1 3
650 0 _aMicroelectromechanical systems.
_93145
650 0 _aMicroelectronic packaging.
_924050
700 1 _aHsu, Tai-Ran.
_9111838
907 _a.b10526572
_b07-11-22
_c01-01-19
998 _am
_b06-11-22
_cm
_da
_e-
_feng
_g
_h0
999 _c44014
_d44014