000 | 00938cam a2200277 i 4500 | ||
---|---|---|---|
001 | u57013 | ||
003 | SIRSI | ||
005 | 20240619150423.0 | ||
008 | 110131 eng | ||
020 | _a0863413358 | ||
050 |
_aTK7875 _b.M46 2004 |
||
245 | 0 | 0 |
_aMems packaging / _cedited by Tai-Ran Hsu. |
264 | 1 |
_aLondon : _bInstitution of Electrical Engineers, _c2004. |
|
300 |
_axxix, 275 pages : _billustrations ; _c26 cm. |
||
336 |
_atext _btxt _2rdacontent |
||
337 |
_aunmediated _bn _2rdamedia |
||
338 |
_avolume _bnc _2rdacarrier |
||
490 | 1 |
_aEMIS processing series ; _v3 |
|
596 | _a1 3 | ||
650 | 0 |
_aMicroelectromechanical systems. _93145 |
|
650 | 0 |
_aMicroelectronic packaging. _924050 |
|
700 | 1 |
_aHsu, Tai-Ran. _9111838 |
|
907 |
_a.b10526572 _b07-11-22 _c01-01-19 |
||
998 |
_am _b06-11-22 _cm _da _e- _feng _g _h0 |
||
999 |
_c44014 _d44014 |