| 000 | 00996cam a22002774i 4500 | ||
|---|---|---|---|
| 001 | u133809 | ||
| 003 | SIRSI | ||
| 005 | 20240619145009.0 | ||
| 008 | 110509s2011 ch a b 001 0 eng | ||
| 020 | _a9780470827802 | ||
| 020 | _a0470827807 | ||
| 050 | 1 | 4 |
_aTK7870.15 _b.L58 2011 |
| 100 | 1 |
_aLiu, Sheng. , _eauthor _954252 |
|
| 245 | 1 | 0 |
_aModeling and simulation for microelectronic packaging assembly : _bmanufacturing, reliability, and testing / _cSheng Liu, Yong Liu. |
| 264 | 1 |
_aSingapore : _bWiley, _c2011. |
|
| 300 |
_axxii, 564 pages : _billustrations ; _c26 cm. |
||
| 336 |
_atext _btxt _2rdacontent |
||
| 337 |
_aunmediated _bn _2rdamedia |
||
| 338 |
_avolume _bnc _2rdacarrier |
||
| 596 | _a1 3 | ||
| 650 | 0 |
_aMicroelectronic packaging _xSimulation methods. _924050 |
|
| 700 | 1 |
_aLiu, Yong. _954253 |
|
| 907 |
_a.b10084769 _b07-11-22 _c15-03-18 |
||
| 998 |
_am _b06-11-22 _cm _da _e- _feng _gch _h0 |
||
| 999 |
_c5086 _d5086 |
||