| 000 | 01011cam a2200277 i 4500 | ||
|---|---|---|---|
| 001 | u52070 | ||
| 003 | SIRSI | ||
| 005 | 20240619145109.0 | ||
| 008 | 110131 eng | ||
| 020 | _a0071428283 | ||
| 050 |
_aTK7870.15 _b.A73 2004 |
||
| 245 | 0 | 0 |
_aArea array packaging materials : _badhesives, pastes and lead-free / _ceditor Ken Gilleo. |
| 264 | 1 |
_aNew York : _bMcGraw-Hill, _c2004. |
|
| 300 |
_aviii, 166 pages : _billustrations ; _c24 cm. |
||
| 336 |
_atext _btxt _2rdacontent |
||
| 337 |
_aunmediated _bn _2rdamedia |
||
| 338 |
_avolume _bnc _2rdacarrier |
||
| 596 | _a3 | ||
| 650 | 0 |
_aBall grid array technology. _9125495 |
|
| 650 | 0 |
_aMicroelectronic packaging. _924050 |
|
| 700 | 1 |
_aGilleo, Ken. _9125494 |
|
| 907 |
_a.b10130354 _b07-11-22 _c15-03-18 |
||
| 998 |
_am _b06-11-22 _cm _da _e- _feng _g _h0 |
||
| 999 |
_c7638 _d7638 |
||