Normal view MARC view ISBD view

Low cost flip chip technologies : for DCA WLCSP, and PBGA assemblies /

Lau, John H. ,

Low cost flip chip technologies : for DCA WLCSP, and PBGA assemblies / John H. Lau.

ISBN: 0071351418

Subjects--Topical Terms:
Multichip modules (Microelectronics) --Design and construction.
Microelectronic packaging.

LC Class. No.: TK7874 / .L382 2000

Place recall
Print
Add to your cart (remove)
Save record
BIBTEX Dublin Core MARCXML MARC (non-Unicode/MARC-8) MARC (Unicode/UTF-8) MARC (Unicode/UTF-8, Standard) MODS (XML) RIS ISBD
More searches

Search for this title in:
Other Libraries (WorldCat) Other Databases (Google Scholar) Online Stores (Bookfinder.com) Open Library (openlibrary.org)