Low cost flip chip technologies : for DCA WLCSP, and PBGA assemblies / John H. Lau.

By:

Material type: Text

TextPublisher: New York : McGraw-Hill, 2000Content type:

Media type:

Carrier type:

ISBN:

Subject(s):

LOC classification:

Tags from this library: No tags from this library for this title. Log in to add tags.

Average rating: 0.0 (0 votes)

Holdings
Item type	Current library	Call number	Status	Date due	Barcode
Books - Printed	PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH Main Library General	TK7874 .L382 2000 (Browse shelf(Opens below))	Available		1000015247

1 3

There are no comments on this title.

to post a comment.

Back to results