Normal view MARC view ISBD view

Area array packaging processes : for BGA, flip chip and CSP /

Area array packaging processes : for BGA, flip chip and CSP / editor, Ken Gilleo. - x, 260 pages : illustrations ; 25 cm.

ISBN: 0071428291

Subjects--Topical Terms:
Microelectronic packaging.
Multichip modules (Microelectronics).

LC Class. No.: TK7874 / .A73 2004

Place recall
Print
Add to your cart (remove)
Save record
BIBTEX Dublin Core MARCXML MARC (non-Unicode/MARC-8) MARC (Unicode/UTF-8) MARC (Unicode/UTF-8, Standard) MODS (XML) RIS ISBD
More searches

Search for this title in:
Other Libraries (WorldCat) Other Databases (Google Scholar) Online Stores (Bookfinder.com) Open Library (openlibrary.org)