Area array packaging processes : for BGA, flip chip and CSP / editor, Ken Gilleo.

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TextPublisher: New York : McGraw-Hill, 2004Description: x, 260 pages : illustrations ; 25 cmContent type:

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Holdings
Item type	Current library	Call number	Status	Date due	Barcode
Books - Printed	PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH Main Library General	TK7874 .A73 2004 (Browse shelf(Opens below))	Available		1000108953

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