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Solder joint reliability of BGA, CSP, fine picth SMT assemblies /

Lau, John H. ,

Solder joint reliability of BGA, CSP, fine picth SMT assemblies / John H. LAu, Yi-Hsin Pao.

ISBN: 0070366489

Subjects--Topical Terms:
Microelectronic pakaging --Reliability.
Solder and soldering --TEsting.
Multichip modules (Microelectronics) --Testing.

LC Class. No.: TK7874 / .L38 1997

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