Solder joint reliability of BGA, CSP, fine picth SMT assemblies / (Record no. 36019)
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| 000 -LEADER | |
|---|---|
| fixed length control field | 01058cam a2200289 i 4500 |
| 001 - CONTROL NUMBER | |
| control field | u9538 |
| 003 - CONTROL NUMBER IDENTIFIER | |
| control field | SIRSI |
| 005 - DATE AND TIME OF LATEST TRANSACTION | |
| control field | 20240619150129.0 |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
| fixed length control field | 990725 00 eng |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| International Standard Book Number | 0070366489 |
| 050 ## - LIBRARY OF CONGRESS CALL NUMBER | |
| Classification number | TK7874 |
| Item number | .L38 1997 |
| 100 1# - MAIN ENTRY--PERSONAL NAME | |
| Personal name | Lau, John H. , |
| Relator term | author |
| 9 (RLIN) | 24049 |
| 245 10 - TITLE STATEMENT | |
| Title | Solder joint reliability of BGA, CSP, fine picth SMT assemblies / |
| Statement of responsibility, etc. | John H. LAu, Yi-Hsin Pao. |
| 264 #1 - PRODUCTION, PUBLICATION, DISTRIBUTION, MANUFACTURE, AND COPYRIGHT NOTICE | |
| Place of production, publication, distribution, manufacture | New York : |
| Name of producer, publisher, distributor, manufacturer | McGraw-Hill, |
| Date of production, publication, distribution, manufacture, or copyright notice | 1997. |
| 336 ## - CONTENT TYPE | |
| Content type term | text |
| Content type code | txt |
| Source | rdacontent |
| 337 ## - MEDIA TYPE | |
| Media type term | unmediated |
| Media type code | n |
| Source | rdamedia |
| 338 ## - CARRIER TYPE | |
| Carrier type term | volume |
| Carrier type code | nc |
| Source | rdacarrier |
| 420 ## - | |
| -- | Electronic pakaging and interconnection series |
| 596 ## - | |
| -- | 3 |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | Microelectronic pakaging |
| General subdivision | Reliability. |
| 9 (RLIN) | 209326 |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | Solder and soldering |
| General subdivision | TEsting. |
| 9 (RLIN) | 10084 |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | Multichip modules (Microelectronics) |
| General subdivision | Testing. |
| 9 (RLIN) | 86542 |
| 700 0# - ADDED ENTRY--PERSONAL NAME | |
| Personal name | Pao, Yi-Hsin. |
| 9 (RLIN) | 209327 |
| 907 ## - LOCAL DATA ELEMENT G, LDG (RLIN) | |
| a | .b1044659x |
| b | 07-11-22 |
| c | 28-11-18 |
| 998 ## - LOCAL CONTROL INFORMATION (RLIN) | |
| -- | m |
| Operator's initials, OID (RLIN) | 06-11-22 |
| Cataloger's initials, CIN (RLIN) | m |
| First date, FD (RLIN) | a |
| -- | - |
| -- | eng |
| -- | |
| -- | 0 |
| Withdrawn status | Lost status | Damaged status | Not for loan | Home library | Current library | Shelving location | Date acquired | Total checkouts | Full call number | Barcode | Date last seen | Price effective from | Koha item type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH | PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH | Main Library General | 18/06/2024 | TK7874 .L38 1997 | 1000020858 | 18/06/2024 | 18/06/2024 | Books - Printed |