Your search returned 122 results.

Results
	41.	IC component sockets / Weifeng Liu, Michael Pecht. by Lui, Weifeng [author] Pecht, Michael Material type: Text; Format: print Publisher: Hoboken, NJ : John Wiley, 2004 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (1)Call number: TK7868.P7 .L58 2004. Place hold Place recall Add to cart (remove)
	42.	Area array packaging materials : adhesives, pastes and lead-free / editor Ken Gilleo. by Gilleo, Ken Material type: Text; Format: print Publisher: New York : McGraw-Hill, 2004 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (2)Call number: TK7870.15 .A73 2004, ... Place hold Place recall Add to cart (remove)
	43.	Packaging, reliability and manufacturing issues associated with electronic and photonic products / edited by Suresh Sitraman...[et al.] by Sitaraman, Suresh ASME International Mechanical Engineering Congresses and Exposition 2001 : New York Material type: Text; Format: print Publication details: New York : The American Society of Mechanical Engineers, 2001 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (1)Call number: TK7870.15 .P32 2001. Place hold Place recall Add to cart (remove)
	44.	Electronic packaging and interconnection handbook / Charles A. Harper. by Harper, Charles A [author] Edition: 4th ed. Material type: Text; Format: print Publisher: New York : McGraw-Hill, 2005 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (1)Call number: TK7870.15 .H37 2005. Place hold Place recall Add to cart (remove)
	45.	Area array package design : techniques in high-density electronics / edited by Ken Gilleo. by Gilleo, Ken Material type: Text; Format: print Publisher: New York : McGraw-Hill, 2004 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (1)Call number: TK7870.15 .A734 2004. Place hold Place recall Add to cart (remove)
	46.	No cover image available Using computer technology to achieve packaging line integration and automation. by Institute of Packaging Professionals Material type: Text; Format: print Publisher: Herndon, VA : Institute of Packaging Professionals, 1993 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (1)Call number: TK7870.15 .U84 1993. Place hold Place recall Add to cart (remove)
	47.	Microelectronic packaging / edited by M. Datta, T. Osaka and J. W. Schultze. by Datta, Madhav Osaka, Tetsuya Schultze, J. W Series: Material type: Text; Format: print Publisher: Boca Raton : CRC Press, 2005 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (1)Call number: TK7870.15 .M52 2005. Place hold Place recall Add to cart (remove)
	48.	No cover image available Soldering processes and equipment / edited by Michael G. Pecht. by Pecht, Michael G Material type: Text; Format: print Publisher: New York : John Wiley, 1993 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (1)Call number: TK7870.15 .P434 1993. Place hold Place recall Add to cart (remove)
	49.	Plastics packaging : properties, processing, applications and regulations / Susan E. M. Selke, John D. Culter and Ruben J. Hernandez. by Selke, Susan E. M [author] Culter, John D Hernandez, Ruben J Edition: 2nd ed. Material type: Text; Format: print Publisher: Cincinnati, OH : Hanser Gardner Publications, 2004 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (1)Call number: TS198.3.P5 .S44 2004. Place hold Place recall Add to cart (remove)
	50.	Lead-free soldering in electronics : science, technology and environmental impact / edited by Katsuaki Suganuma. by Suganuma, Katsuaki Material type: Text; Format: print Publisher: New York : Marcel Dekker, 2004 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (1)Call number: TK7870.15 .L42 2004. Place hold Place recall Add to cart (remove)
	51.	MEMS/MOEMS packaging : concepts, designs, materials and processes / Ken Gilleo. by Gilleo, Ken [author] Series: Material type: Text; Format: print Publisher: New York : McGraw-Hill, 2005 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (1)Call number: TK7870.15 .G55 2005. Place hold Place recall Add to cart (remove)
	52.	Advanced wirebond interconnection technology / Shankara K. Prasad. by Prasad, Shankara K [author] Material type: Text; Format: print Publisher: Boston : Kluwer Academic Publishers, 2004 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (1)Call number: TK7836 .P72 2004. Place hold Place recall Add to cart (remove)
	53.	Electronic packaging of hight speed circurity / Stephen G. Konsowski, Arden R. Helland. by Konsowski, Stephen G [author] Helland, Arden R Material type: Text; Format: print Publisher: New York : McGraw-Hill, 1997 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (1)Call number: TK7870 .K66 1997. Place hold Place recall Add to cart (remove)
	54.	Electronic packaging : design, materials, process, and reliability / John H Lau... (et al). by Lau, John H Material type: Text; Format: print Publisher: New York : McGraw-Hill, 1998 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (1)Call number: .TK7870.15/b .E53 1998. Place hold Place recall Add to cart (remove)
	55.	The packaging and design templates sourcebook / [compiled by Luke Herriott] by Herriott, Luke Material type: Text; Format: print Publication details: East Sussex : RotoVision, 2007 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (1)Call number: TS195.4 .P32 2007. Place hold Place recall Add to cart (remove)
	56.	Packaging design : successful product branding from concept to shelf / Marianne Rosner Klimchuk, Sandra A. Krasovec. by Klimchuk, Marianne Rosner [author] Krasovec, Sandra A Material type: Text; Format: print Publisher: Hoboken, NJ : John Wiley, 2006 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (1)Call number: TS195.4 .K54 2006. Place hold Place recall Add to cart (remove)
	57.	Design matters : packaging 01 : an essential primer for today's competitive market / Capsule. Series: Material type: Text; Format: print Publisher: Beverly, MA : Rockport, 2008 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (1)Call number: TS195.4 .D47 2008. Place hold Place recall Add to cart (remove)
	58.	Environmentally compatible food packaging / edited by Emo Chiellini. by Chiellini, Emo Series: Material type: Text; Format: print Publisher: Cambridge : Woodhead Pub., 2008 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (2)Call number: TP374 .E58 2008, ... Place hold Place recall Add to cart (remove)
	59.	Food product design : an integrated approach / edited by Anita R. Linnemann, Martinus A. J. S. van Boekel. by Linnemann, Anita R Boekel, Martinus A. J. S. van Material type: Text; Format: print Publisher: Wageningen : Wageningen Academic, 2007 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (1)Call number: TP370 .F68 2007. Place hold Place recall Add to cart (remove)
	60.	Food packaging and shelf life : a practical guide / edited by, Gordon L. Robertson. by Robertson, Gordon L Material type: Text; Format: print Publisher: Boca Raton, FL : CRC, 2010 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (1)Call number: TP374 .F66 2010. Place hold Place recall Add to cart (remove)

First
Previous
1
2
3
4
5
6
7
Next
Last

Refine your search

Availability

Authors

Holding libraries

Item types

Locations

Series

Topics

Your search returned 122 results.