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	1.	Electronics manufacturing : with lead-free, halogen-free, and conductive-adhesive materials / John H. Lau ... [and others]. by Lau, John H Material type: Text; Format: print Publisher: New York : McGraw-Hill, 2003 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (1)Call number: TK7836 .E44 2003. Place hold Place recall Add to cart (remove)
	2.	Electronic packaging : design, materials, process, and reliability / John H Lau... (et al). by Lau, John H Material type: Text; Format: print Publisher: New York : McGraw-Hill, 1998 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (1)Call number: .TK7870.15/b .E53 1998. Place hold Place recall Add to cart (remove)
	3.	Low cost flip chip technologies : for DCA WLCSP, and PBGA assemblies / John H. Lau. by Lau, John H [author] Material type: Text; Format: print Publisher: New York : McGraw-Hill, 2000 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (1)Call number: TK7874 .L382 2000. Place hold Place recall Add to cart (remove)
	4.	Solder joint reliability of BGA, CSP, fine picth SMT assemblies / John H. LAu, Yi-Hsin Pao. by Lau, John H [author] Pao, Yi-Hsin Material type: Text; Format: print Publisher: New York : McGraw-Hill, 1997 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (1)Call number: TK7874 .L38 1997. Place hold Place recall Add to cart (remove)

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