Modeling and simulation for microelectronic packaging assembly : manufacturing, reliability, and testing / Sheng Liu, Yong Liu.

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TextPublisher: Singapore : Wiley, 2011Description: xxii, 564 pages : illustrations ; 26 cmContent type:

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Holdings
Item type	Current library	Call number	Status	Date due	Barcode
Books - Printed	PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH Main Library General	TK7870.15 .L58 2011 (Browse shelf(Opens below))	Available		1000284114

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