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	1.	Electrical conductive adhesives with nanotechnologies / Yi Li, Daniel Lu, C. P. Wong, by Li, Yi Lu, Daniel Wong, C. P Material type: Text; Format: print Publication details: New York : Springer, 2010 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (1)Call number: TK7870.15 .L59 2009. Place hold Place recall Add to cart (remove)
	2.	Soldering handbook for printed circuits and surface mounting : design, materials, processes, equipment, trouble-shooting, quality, economy, and line management / Howard H Manko by Manko, Howard H Material type: Text; Format: print Publication details: New York : Van Nostrand Reinhold, 1986 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (2)Call number: TK7868 .P7 .36 1986, ... Place hold Place recall Add to cart (remove)
	3.	Quality hand soldering and circuit board repair / H. Ted Smith. by Smith, H. Ted [author] Edition: 3rd ed. Material type: Text; Format: print Publisher: New York : Delmar, 1997 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (2)Call number: TK7868.P7 .S58 1997, ... Place hold Place recall Add to cart (remove)
	4.	Soldering in electronics assembly / Mike Judd, Keith Brindley. by Judd, Mike [author] Brindley, Keith Edition: 2nd ed. Material type: Text; Format: print Publisher: Oxford : Newnes, 1999 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (1)Call number: TK7868.P7 .J83 1999. Place hold Place recall Add to cart (remove)
	5.	Reflow soldering processes : SMT, BGA, CSP AND flip chip technology / Ning-Cheng Lee. by Lee, Ning-Cheng [author] Material type: Text; Format: print Publisher: Boston : Newnes, 2002 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (1)Call number: TK7836 .L43 2002. Place hold Place recall Add to cart (remove)
	6.	Quality hand soldering and circuit board repair / H. Ted Smith. by Smith, H. Ted [author] Edition: 4th ed. Material type: Text; Format: print Publisher: Clifton Park, NY : Delmar Learning, 2004 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (1)Call number: TK7868.P7 .S64 2004. Place hold Place recall Add to cart (remove)
	7.	Lead-free soldering in electronics : science, technology and environmental impact / edited by Katsuaki Suganuma. by Suganuma, Katsuaki Material type: Text; Format: print Publisher: New York : Marcel Dekker, 2004 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (1)Call number: TK7870.15 .L42 2004. Place hold Place recall Add to cart (remove)
	8.	Quality hand soldering and circuit board repair / H. Ted Smith. by Smith, H. Ted [author] Edition: 5th ed. Material type: Text; Format: print Publisher: Clifton Park : Thomson, 2008 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (1)Call number: TK7868.P7 .S58 2008. Place hold Place recall Add to cart (remove)
	9.	Lead-free electronic solders : a special issue of journal of materials Science : materials in electronics / edited by K. N. Subramanian. by Subramanian, K. N [author] Material type: Text; Format: print Publisher: New York : Springer Science, 2007 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (1)Call number: TK7836 .S92 2007. Place hold Place recall Add to cart (remove)
	10.	Solder joint reliability prediction for multiple environments / Andrew E. Perkins, Suresh K. Sitaraman. by Perkins, Andrew E [author] Sitaraman, Suresh K Material type: Text; Format: print Publisher: New York : Springer, 2009 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (1)Call number: TK7870.15 .P47 2009. Place hold Place recall Add to cart (remove)
	11.	Lead-free electronics : iNEMI projects lead to successful manufacturing / edited by Edwin Bradley ... [and others]. by Bradley, Edwin Material type: Text; Format: print Publisher: Hoboken, NJ : John Wiley, 2007 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (1)Call number: TS610 .L42 2007. Place hold Place recall Add to cart (remove)
	12.	Solder joint reliability of BGA, CSP, fine picth SMT assemblies / John H. LAu, Yi-Hsin Pao. by Lau, John H [author] Pao, Yi-Hsin Material type: Text; Format: print Publisher: New York : McGraw-Hill, 1997 Availability: Items available for loan: PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH (1)Call number: TK7874 .L38 1997. Place hold Place recall Add to cart (remove)

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