Solder joint reliability of BGA, CSP, fine picth SMT assemblies / John H. LAu, Yi-Hsin Pao.

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TextPublisher: New York : McGraw-Hill, 1997Content type:

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Holdings
Item type	Current library	Call number	Status	Date due	Barcode
Books - Printed	PERPUSTAKAAN GUNASAMA HAB PENDIDIKAN TINGGI PAGOH Main Library General	TK7874 .L38 1997 (Browse shelf(Opens below))	Available		1000020858

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